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Applications Opengrants

BUD Fund – Easy BUD

domainTrade and Industry Department / BUD FundverifiedVerified · Sep 20
Funding / Offer
Funding ceiling HK$150,000 per application; counted toward the HK$7 million cumulative enterprise ceiling; 30-working-day processing pledge.
scheduleDurationDeadline: Ongoing application route; current guide applies.
pie_chartEquity0%
eventStatusApplications Open
schedule
Duration
Deadline: Ongoing application route; current guide applies.
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Equity
0%
payments
Funding
Funding ceiling HK$150,000 per application; counted toward the HK$7 million cumulative enterprise ceiling; 30-working-day processing pledge.
military_tech
Selectivity
Competitive

infoAbout this program

Simplified BUD route for designated business-development measures in covered Mainland and target markets.

inventory_2What's Included

4 items
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Funding

Funding ceiling HK$150,000 per application; counted toward the HK$7 million cumulative enterprise ceiling; 30-working-day processing pledge.

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Equity

0%

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Program

Trade and Industry Department / BUD Fund

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Type

Grant

checklistEligibility

1 items
  • check_circleNon-listed Hong Kong enterprises meeting the Easy BUD requirements.

helpFAQ

tagTags & categories

#Grants#BUD, Easy-BUD, SME, market-expansion