Applications Opengrants
BUD Fund – General Application
domainTrade and Industry Department / BUD Fund·verifiedVerified · Sep 20
Funding / Offer
Funding ceiling HK$800,000 per general application; cumulative funding ceiling HK$7 million per enterprise.
scheduleDurationDeadline: Ongoing application route; current market coverage and guide apply.
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eventStatusApplications Open
schedule
Duration
Deadline: Ongoing application route; current market coverage and guide apply.
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Equity
0%
payments
Funding
Funding ceiling HK$800,000 per general application; cumulative funding ceiling HK$7 million per enterprise.
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Selectivity
Competitive
infoAbout this program
Supports non-listed Hong Kong enterprises developing business in the Mainland and other covered target markets through branding, upgrading and domestic-sales measures.
inventory_2What's Included
4 itemscheck_circle
Funding
Funding ceiling HK$800,000 per general application; cumulative funding ceiling HK$7 million per enterprise.
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Equity
0%
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Program
Trade and Industry Department / BUD Fund
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Type
Grant
checklistEligibility
1 items- check_circleNon-listed Hong Kong enterprises meeting BUD Fund requirements.
helpFAQ
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#Grants#BUD, market-expansion, branding, SME