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Applications Opengrants

BUD Fund – General Application

domainTrade and Industry Department / BUD FundverifiedVerified · Sep 20
Funding / Offer
Funding ceiling HK$800,000 per general application; cumulative funding ceiling HK$7 million per enterprise.
scheduleDurationDeadline: Ongoing application route; current market coverage and guide apply.
pie_chartEquity0%
eventStatusApplications Open
schedule
Duration
Deadline: Ongoing application route; current market coverage and guide apply.
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Equity
0%
payments
Funding
Funding ceiling HK$800,000 per general application; cumulative funding ceiling HK$7 million per enterprise.
military_tech
Selectivity
Competitive

infoAbout this program

Supports non-listed Hong Kong enterprises developing business in the Mainland and other covered target markets through branding, upgrading and domestic-sales measures.

inventory_2What's Included

4 items
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Funding

Funding ceiling HK$800,000 per general application; cumulative funding ceiling HK$7 million per enterprise.

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Equity

0%

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Program

Trade and Industry Department / BUD Fund

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Type

Grant

checklistEligibility

1 items
  • check_circleNon-listed Hong Kong enterprises meeting BUD Fund requirements.

helpFAQ

tagTags & categories

#Grants#BUD, market-expansion, branding, SME